Abstract: Extremely large-scale array (XL-array) and Terahertz (THz) band have emerged as key research areas in the sixth generation (6G) network. As such, the near-field communication becomes more ...

Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...