Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

Chemical mechanical polishing (CMP) of silicon carbide (SiC) is an essential process in the fabrication of high-performance semiconductor devices. SiC is prized for its exceptional hardness, thermal ...

Chemical mechanical polishing (CMP) is a process of global planarization that leverages the synergetic effect of chemical reactions and mechanical abrasion to facilitate wafer polishing. CMP has ...

PHOENIX, Ariz. and HSINCHU, Taiwan — September 12, 2007— Rohm and Haas Electronic Materials, CMP Technologies, a leader and innovator in chemical mechanical planarization technology for the global ...