COLORADO SPRINGS, CO (September 9, 2025) Frontgrade Technologies, a leading provider of high-reliability electronic solutions for space and national security missions, today announced the release of ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Infineon is looking to meet the power challenges of data centers as artificial intelligence (AI) becomes more important and more power-hungry. Power modules are needed to support AI accelerators, ...
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