System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

In the composites industry, compression molding is among the apparently simplest processes available for fabrication: Insert material, close mold, add pressure, add heat, wait, cool mold, open mold, ...

Until now, simulative mold and process design were limited mainly to modern injection molding technology. SIGMASOFT® has already been utilized successfully by leading elastomers processors, and their ...